RJ45 Transceiver

Transform unoccupied SFP cages into extra RJ45 ports on your GigaCore Ethernet switch.

N

Fiber Compatibility

This hot-pluggable transceiver is capable of transmission at 2 to 550 meters with 50/125 μm fiber, and at 2 to 275 meters with 62.5 125 μm fiber, for 1.25 GBd Ethernet. It is capable of transmission up to 500m with 50/125 μm fiber and up to 300m with 62.5/125 μm fiber, for 1.0625 GBd Fiber Channel.

N

Operating temperature from -40 to 85° C

Recommended Operating Conditions are those within which functional performance within data sheet characteristics is intended. This SFP Transceiver can operate in temperatures between 0 and 70° C.

N

Compliant to IEEE 802.3 Gigabit Ethernet (1.25GBd) 1000BaseSX

The MMF Transceivers are compliant with the specifications set forth in the IEEE802.3 (1000Base-SX) and the Small Form-Factor Pluggable (SFP) Multi-Source Agreement (MSA). Its primary application is servicing Gigabit Ethernet links between optical networking equipment like f.e. the GigaCore 16Xt or 26i.

N

Eye safety certified

The transceiver provides Class 1 eye safety by design. The eye safety circuit continuously monitors optical output power levels and will disable the transmitter and assert a TX_FAULT signal upon detecting an unsafe condition. Such unsafe conditions can be created by inputs from the host board (Vcc fluxuation, unbalanced code) or faults within the module.

N

Diagnostic Monitoring

The DDM function provides component monitoring on transceiver applications in details. A DDM interface can include a system of alarm and warning flags which alert the host system when particular operating parameters for transmitted power, received power, laser bias current, temperature or supply voltage are outside of a factory set normal operating.

N

850 nm Vertical Cavity Surface Emitting Laser (VCSEL)

The VCSEL is a type of semiconductor laser diode with laser beam emission perpendicular from the top surface, contrary to conventional edge-emitting semiconductor lasers (also in-plane lasers) which emit from surfaces formed by cleaving the individual chip out of a wafer.

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